product
Rigid PCB
   
Multi-Layer

Materials:

 

- FR-4/ PTFE/ Halogen-Free/ High Tg/ High CTI/ Getek/ Rogers

 

Maximum Board Size:

 

- 508mm x 560mm 

Board Thickness:

 

- 0.1mm to 3.2mm

Copper Weight:

 

- 1/2oz to 5oz

Minimum Line Width/ Spacing:

 

- 0.1mm / 0.1mm

Minimum Hole Diameter:

 

- 0.1mm

Maximum Hole Wall Copper Weight:

 

- 2oz

Solder Resist:

 

- Liquid Photo Image(LPI)

Surface Finishing:

 

- Electroless Nickel Immersion Gold(ENIG)

 

- Immersion Silver

 

- Immersion Tin

 

- Flash Gold / Bonding Gold

 

- Gold Finger

 

- Lead-Free HAL(Hot-Air-Leveling)

 

- Organic Solderability Preservative(OSP)

 

Outline Profiling:

 

- CNC Routing

 

- V-cut / CNC V-cut

 

- Breakaway tab/ Multi-hits

 

 

Special Technologies:

 

- Blind/ Buried Via

 

- Ball-grid Array(BGA)

 

- High Density Interconnect(HDI)

 

- Laser Drilling

 

- Selective Plating

 

- Peelable mask

 

- Countersink Hole

 

- CNC V-cut

 

- Impedance Control

 

- AOI Test/ Fly-Probe Test

 

 
 

 

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